The Bender Element System (BES) is a set of exquisite tools for measuring the dynamic performance indexes of soil masses developed by the British GDS company.
GDS bender elements can easily measure the maximum shear modulus of soil at small strains in a triaxial pressure chamber. Since the resolution and accuracy of the load and displacement measuring devices are not enough, it is very difficult to measure the stiffness of the soil under small strain conditions indoors. In the past, the local strain sensor was usually used to measure the small strain stiffness in the triaxial test, but this sensor is very expensive and is usually used for scientific research.
GDS bender chip makes it easier to measure the maximum shear modulus of the soil under small strains in the triaxial pressure chamber. The system uses a pair of curved chips, one to transmit and the other to receive, to transmit S and P waves in the soil.
